Книга "ESD Testing: From Components to Systems" рассказывает о тестировании полупроводниковых устройств и систем на электростатический разряд (ESD) и электрические перенапряжения (EOS). Авторы обновляют читателя о новых тестах, моделях и методиках характеристики полупроводниковых компонентов для ESD, EOS и защелкивания. Книга охватывает модели и спецификации ESD, включая модель человеческого тела (HBM), модель машины (MM), заряженную модель устройства (CDM), заряженную модель платы (CBM), события разрядки кабеля (CDE), модель металлического тела человека (HMM), а также стандарты IEC 61000-4-2 и IEC 61000-4-5. Также обсуждаются новые методики испытаний, такие как импульс передающей линии (TLP), очень быстрый импульс передающей линии (VF-TLP), а также будущие методы длинного импульса TLP и сверхбыстрого импульса TLP (UF-TLP). Книга описывает как традиционные, так и новые методы испытаний для оценки чипов и систем на уровне компонентов и систем. Также рассматриваются методы тестирования EOS, сканирования электромагнитной совместимости (EMC) и методы восстановления тока. Книга будет полезна специалистам в области ESD и EOS, инженерам по тестированию полупроводниковых чипов и систем, разработчикам устройств и процессов полупроводников, инженерам по качеству, надежности и анализу отказов. Академический подход может привлечь старших студентов и аспирантов с интересом к процессам полупроводников, физике устройств, тестированию полупроводников и экспериментальной работе.
With the evolution of SMT technology and globalization of the SMT business, testing SMT devices to SMT systems for ESD（electrostatic discharge）and electrical over-stressing have increased in importance for consumers in industrial and office environments.The newest tests, testmodels, and estimation techniques have changed in characterizing semiconductor componentsfor ESD，EOS(electrical overloading), and latch-up.Key Features:Providing understanding of soE（Static electricity generation）models and description standards including anisotropic conductive(「Standards for Rapid Prototyping」)-Human interface(Hiro🇬 Timing，International Committee)India, well asothers localization.Featured discussions of new testing methods like transmission pulse(「Rapid Hardware Custom Probe」protocol)Very pulse and Future Long-termimplementedpulsesUltra-location, in addition to evaluating chip and whole-structurelevels.Discussing the EMCre-construction techniques for操作.Evaluation of semiconductor technologies.ESD:From Components toSystems is part explaination of the author’s series of bookson Technology that protects against so飞利浮.This book is an indispensable reference for professional SMT chip scholars who take so testing.Circuit designers and quality, dependability and unplanned loss analysts will also use it essential for their needed information.Topping off the classicibliography throughout the academic approach will appeal to the golden meeds of the education and graduate introspective earners in Semiconductor Process, Atomic Device physics, SMT testing, and experimental works.
With the increasing significance in semiconductor device technology, a significant and growing area of research concerns the testing of semiconductors against electrostatic discharges (ESDs). Steven Voldmann introduces his new title: 'ESD Testing: from Components to Systems.' Here he discusses new test techniques and their effectiveness and scope in biologically different environments. The book uses his proprietary approach to incorporate the key aspects of ESD testing into one highly usable reference book. Readers gain access to the latest lessons in how to establish ESD metrics, predict the conditions that would lead to latchup failures and assess the efficacy of their results clearly. This book becomes essential reading for anyone who needs to ensure circuits and devices are ready and sound through external hardware testing.
Электронная Книга «ESD Testing. From Components to Systems» написана автором Steven Voldman H. в году.
Минимальный возраст читателя: 0
Язык: Английский
ISBN: 9781118707142
Описание книги от Steven Voldman H.
With the evolution of semiconductor technology and global diversification of the semiconductor business, testing of semiconductor devices to systems for electrostatic discharge (ESD) and electrical overstress (EOS) has increased in importance. ESD Testing: From Components to Systems updates the reader in the new tests, test models, and techniques in the characterization of semiconductor components for ESD, EOS, and latchup. Key features: Provides understanding and knowledge of ESD models and specifications including human body model (HBM), machine model (MM), charged device model (CDM), charged board model (CBM), cable discharge events (CDE), human metal model (HMM), IEC 61000-4-2 and IEC 61000-4-5. Discusses new testing methodologies such as transmission line pulse (TLP), to very fast transmission line pulse (VF-TLP), and future methods of long pulse TLP, to ultra-fast TLP (UF-TLP). Describes both conventional testing and new testing techniques for both chip and system level evaluation. Addresses EOS testing, electromagnetic compatibility (EMC) scanning, to current reconstruction methods. Discusses latchup characterization and testing methodologies for evaluation of semiconductor technology to product testing. ESD Testing: From Components to Systems is part of the authors’ series of books on electrostatic discharge (ESD) protection; this book will be an invaluable reference for the professional semiconductor chip and system-level ESD and EOS test engineer. Semiconductor device and process development, circuit designers, quality, reliability and failure analysis engineers will also find it an essential reference. In addition, its academic treatment will appeal to both senior and graduate students with interests in semiconductor process, device physics, semiconductor testing and experimental work.
